拋光墊性能對拋光液的影響

    　拋(pao)(pao)(pao)光(guang)墊(dian)(dian)(dian)(dian)將(jiang)拋(pao)(pao)(pao)光(guang)液(ye)(ye)中的(de)(de)(de)(de)(de)(de)(de)(de)磨粒輸送(song)到工(gong)件(jian)表(biao)面(mian)(mian)，使(shi)(shi)突起的(de)(de)(de)(de)(de)(de)(de)(de)部(bu)分平坦化(hua)(hua)，是輸送(song)拋(pao)(pao)(pao)光(guang)液(ye)(ye)的(de)(de)(de)(de)(de)(de)(de)(de)關鍵部(bu)件(jian)。拋(pao)(pao)(pao)光(guang)墊(dian)(dian)(dian)(dian)的(de)(de)(de)(de)(de)(de)(de)(de)剪切模(mo)量(liang)及彈性(xing)(xing)模(mo)量(liang)、粗(cu)糙度(du)和(he)可(ke)壓縮性(xing)(xing)等機械特性(xing)(xing)對工(gong)件(jian)的(de)(de)(de)(de)(de)(de)(de)(de)平整度(du)及去(qu)除(chu)率(lv)有著重要影響。拋(pao)(pao)(pao)光(guang)墊(dian)(dian)(dian)(dian)的(de)(de)(de)(de)(de)(de)(de)(de)硬(ying)度(du)對拋(pao)(pao)(pao)光(guang)均(jun)勻(yun)(yun)性(xing)(xing)有明顯的(de)(de)(de)(de)(de)(de)(de)(de)影響，硬(ying)墊(dian)(dian)(dian)(dian)可(ke)獲得較好的(de)(de)(de)(de)(de)(de)(de)(de)晶片(pian)內(Within Wafer. WIW)均(jun)勻(yun)(yun)性(xing)(xing)和(he)較好的(de)(de)(de)(de)(de)(de)(de)(de)平面(mian)(mian)度(du)，軟墊(dian)(dian)(dian)(dian)可(ke)改善(shan)芯片(pian)內(Within Die. WID)均(jun)勻(yun)(yun)性(xing)(xing)，通過組(zu)合(he)使(shi)(shi)用(yong)硬(ying)墊(dian)(dian)(dian)(dian)及軟墊(dian)(dian)(dian)(dian)，來獲得良好的(de)(de)(de)(de)(de)(de)(de)(de)WID和(he)WIW，如在圓片(pian)及其(qi)(qi)固(gu)定裝(zhuang)置間加(jia)(jia)一層彈性(xing)(xing)背膜，就可(ke)滿(man)足剛(gang)性(xing)(xing)及彈性(xing)(xing)的(de)(de)(de)(de)(de)(de)(de)(de)雙(shuang)重要求。拋(pao)(pao)(pao)光(guang)墊(dian)(dian)(dian)(dian)按其(qi)(qi)組(zu)成的(de)(de)(de)(de)(de)(de)(de)(de)材(cai)(cai)質，可(ke)以分為(wei)聚氨醋拋(pao)(pao)(pao)光(guang)墊(dian)(dian)(dian)(dian)、無(wu)紡布拋(pao)(pao)(pao)光(guang)墊(dian)(dian)(dian)(dian)、帶絨(rong)毛(mao)結構的(de)(de)(de)(de)(de)(de)(de)(de)無(wu)紡布拋(pao)(pao)(pao)光(guang)墊(dian)(dian)(dian)(dian)和(he)兩(liang)層符合(he)體拋(pao)(pao)(pao)光(guang)墊(dian)(dian)(dian)(dian)。拋(pao)(pao)(pao)光(guang)墊(dian)(dian)(dian)(dian)的(de)(de)(de)(de)(de)(de)(de)(de)表(biao)面(mian)(mian)粗(cu)糙度(du)及多(duo)孔性(xing)(xing)將(jiang)影響工(gong)件(jian)實際參與(yu)加(jia)(jia)工(gong)的(de)(de)(de)(de)(de)(de)(de)(de)面(mian)(mian)積、拋(pao)(pao)(pao)光(guang)液(ye)(ye)的(de)(de)(de)(de)(de)(de)(de)(de)傳輸量(liang)和(he)材(cai)(cai)料(liao)去(qu)除(chu)率(lv)。拋(pao)(pao)(pao)光(guang)墊(dian)(dian)(dian)(dian)表(biao)面(mian)(mian)越(yue)(yue)粗(cu)糙，接觸(chu)的(de)(de)(de)(de)(de)(de)(de)(de)面(mian)(mian)積就越(yue)(yue)大，使(shi)(shi)得材(cai)(cai)料(liao)去(qu)除(chu)率(lv)增大。拋(pao)(pao)(pao)光(guang)墊(dian)(dian)(dian)(dian)經過多(duo)次使(shi)(shi)用(yong)后，其(qi)(qi)表(biao)面(mian)(mian)會(hui)逐漸(jian)“釉化(hua)(hua)”，從而使(shi)(shi)去(qu)除(chu)材(cai)(cai)料(liao)的(de)(de)(de)(de)(de)(de)(de)(de)速度(du)下降。這時(shi)，可(ke)以用(yong)修(xiu)整的(de)(de)(de)(de)(de)(de)(de)(de)方法來恢復(fu)拋(pao)(pao)(pao)光(guang)墊(dian)(dian)(dian)(dian)的(de)(de)(de)(de)(de)(de)(de)(de)粗(cu)糙度(du)，一般采(cai)用(yong)修(xiu)整環(huan)修(xiu)整，達到恢復(fu)或改善(shan)拋(pao)(pao)(pao)光(guang)墊(dian)(dian)(dian)(dian)輸送(song)拋(pao)(pao)(pao)光(guang)液(ye)(ye)的(de)(de)(de)(de)(de)(de)(de)(de)性(xing)(xing)能，從而使(shi)(shi)去(qu)除(chu)速度(du)得到維持且延(yan)長拋(pao)(pao)(pao)光(guang)墊(dian)(dian)(dian)(dian)的(de)(de)(de)(de)(de)(de)(de)(de)壽命。因而改進拋(pao)(pao)(pao)光(guang)墊(dian)(dian)(dian)(dian)、延(yan)長其(qi)(qi)使(shi)(shi)用(yong)壽命從而減小加(jia)(jia)工(gong)損耗是CMP技術的(de)(de)(de)(de)(de)(de)(de)(de)主要挑戰之一。